ASE, USIC Win Intel`s Wireless Module Contracts
Taipei, May 15, 2008 (CENS)--Advanced Semiconductor Engineering (ASE) Inc. and subsidiary Universal Scientific Industrial Co., (USIC) Ltd. recently won contracts to make wireless modules using system-in-package (SiP) technology for Intel.
ASE is one of a few test and assembly houses worldwide to begin using SiP technology to make chips for customers. The technology is more suitable for system-on-chips (SOCs) installed with smaller circuits on them than chip-on-board (COB) packaging technology.
Click here to read complete article