Sequans Unveils New Generation of Mobile WiMAX Chips

BARCELONA, MOBILE WORLD CONGRESS, Booth 2-1.C28, February 16, 2009 – Sequans Communications, the world’s leading WiMAX chipmaker, has introduced its newest chip, the SQN1210, which for the first time integrates baseband and triple band RF in a single 65 nm die, leading to unprecedented achievements in size, cost, and performance. 

“Our new chip delivers the highest level of integration yet achieved in the Mobile WiMAX industry,” said Georges Karam, Sequans CEO.  “With both baseband and RF in a single 65nm die, the SQN1210 delivers industry leading low power consumption and high performance in the tiniest of chips, making it truly the best chip available today for mobile.”

Based on state-of-the-art 65 nm technology and four years of Sequans’ proven field experience, the new SQN1210 delivers dramatically reduced cost, power consumption, and size over previous generation technology in a tiny 10X10 package.  Furthermore, the SQN1210 does not require external DRAM memory, and delivers maximum throughput of greater than 40 Mbps with extremely low power consumption of less than 350 mW with fully loaded MIMO traffic and less than 0.5 mW in standby.  The integrated RF supports TDD and half duplex FDD and covers all three global WiMAX bands, 2.3, 2.5, and 3.5 GHz.  The SQN1210 also supports 2 Tx, as specified in Release 1.5 of the WiMAX system profile, enabling uplink MIMO, a feature unique to Sequans that can nearly double cell coverage.

“Sequans’ SQN1210 single die solution marks a watershed event in the progress and maturity of the WiMAX ecosystem,” said Robert Syputa, partner and senior analyst, Maravedis.  “The chip convincingly demonstrates that silicon to enable mobile devices and CPEs is no longer an obstacle to widespread adoption.  This should be a signal to device manufacturers and operators to move forward to exploit markets despite the cautious economic environment.”

Feature highlights of Sequans SQN1210 SOC for Mobile WiMAX mobile stations

- 65 nm single die, baseband and triple band RF
- supports 2.3-2.4, 2.5-2.7, and 3.3-3.8 GHz bands
- TDD and H-FDD
- supports 2 Tx and uplink MIMO
- ultra low power consumption
- <350 mW in active mode with fully loaded MIMO traffic
- <,0.5 mW in standby mode
- maximum likelihood MIMO performance
- high throughput > 40 Mbps
- supports H-ARQ, up to category 4
- allows full reuse of prior version software
- ready for WiMAX Forum® Certification

“This new technology gives both manufacturers and operators an edge,” said Karam.  “It provides the basis for the sleek and highly efficient Mobile WiMAX devices that one expects for 4G and it significantly improves operator business cases.”

About Sequans

Sequans Communications is the leading supplier of chips for the WiMAX market.  Sequans has products that are WiMAX Forum Certified™ for both fixed and Mobile WiMAX, for both base station and subscriber station technology, and is the first and only WiMAX chipmaker to achieve this distinction.  Sequans is currently powering more than half of the WiMAX Forum Certified™ Mobile WiMAX (MIMO) devices now coming to market.  Sequans offers equipment manufacturers the most complete and powerful semiconductor solutions available today, enabling them to build the widest range of high performing WiMAX network components: femto, pico, micro and multi-sector macro base stations, outdoor and indoor subscriber terminals, home gateways, and all types of mobile devices.  www.sequans.com

Press contact Sequans: Kimberly Tassin, 206.654.1001, Kimberly@sequans.com